Name | : | Dr. Wisnu Aribowo, ST., MT. |
Lecturer | ||
: | wisnu@mail.ti.itb.ac.id | |
Research Division | : | Manufacturing System |
Field of Interest | : | 1. Manufacturing Automation |
: | 2. Manufacturing System (Product, Process, Facility) Design | |
: | 3. Production Planning & Control | |
Education | : | |
: | 1. Doctor (Toyohashi University of Technology, Japan) | |
: | 2. Master (Institut Teknologi Bandung, Indonesia) | |
: | 3. Undergraduate (Institut Teknologi Bandung, Indonesia) | |
Publication
International Journal:
- Aribowo, W., T. Yamashita and K. Terashima, “Integrated Trajectory Planning and Sloshing Suppression for Three-Dimensional Motion of Liquid Container Transfer Robot Arm,” Journal of Robotics, vol. 2015, article ID 279460, (Scopus) 2015.
International Proceedings:
- Aribowo. W., and K. Terashima, “Cubic Spline Trajectory Planning and Vibration Suppression of Semiconductor Wafer Transfer Robot Arm,” International Journal of Automation Technology, vol. 8, no. 2, pp. 265-274, (Scopus) 2014.
- Aribowo, W., K. Terashima, “An Implementation of Cubic Spline Optimization with Floating Via Points and Vibration Suppression for Trajectory Planning of Industrial Robot Arm”, Proceedings of 2013 SICE Annual Conference, (Scopus) 2013.
- Matsuo, Y. Ochi, W. Aribowo, R. Tasaki, K. Terashima, T. Yamomoto, T. Sakakibara, “Tracking Control System for Walking Assist Using Intention Estimation”, Proceedings of 15th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines, (Scopus) 2012.
- Aribowo. W., Y. Masui, T. Yamashita, K. Terashima, “Vibration Control of Semiconductor Wafer Transfer Robot By Building an Integrated Tool of Parameter Identification and Input Shaping”, Proceedings of 18th IFAC World Congress 2011
- Aribowo, W., Yamashita, T., Terashima, K., Kitagawa, H., “Input shaping control to suppress sloshing on liquid container transfer using multi-joint robot arm“, IEEE/RSJ 2010 International Conference on Intelligent Robots and Systems, IROS 2010 – Conference Proceedings 5650412, pp. 3489-3494, (Scopus) 2010